王珺

教授  

办公地点:材料一楼308室   

联系电话:021-65643263   

电子邮箱:jun_wang@apnabalochistan.com

教育和工作经历

  • 2018/12至今,复旦大学材料科学系教授

  • 2005/8-2018/11,复旦大学材料科学系讲师、副教授

  • 2003/8-2005年7月,在复旦大学材料科学系从事博士后研究

  • 2002/6 毕业于西南交通大学,获固体力学博士学位

  • 2001/1-2003/6,香港科技大学机械工程系访问,担任研究助理

  • 1995/9-1998/2,西南交通大学工程科学研究院,计算力学,硕士

  • 1991/9-1995/7,西南交通大学铁道工程,本科

研究方向

  • 微电子封装中计算分析和可靠性研究

  • 材料微观结构的力学模型和模拟

  • 新型材料数据库应用研究

主讲课程

  • 《材料力学》 本科生专业课程,复旦大学校级精品建设课程

  • 《数学物理方法》 本科生专业课程

  • 《固体材料力学性能与分析》研究生课程

代表性论文或论著

  1. Wang Lei, Wang Jun*, Xiao Fei. Study on BEOL failures in a Chip by Shear Tests of Copper Pillar Bumps[J]. Journal of Electronic Packaging, 2019.

  2. Yang Chen, Wang Lei, Yu Kehang, Wang Jun*. Assess low-k/ultralow-k materials integrity by shear test on bumps of a chip[J]. Journal of Materials Science: Materials in Electronics, 2018, 29(19): 16416–16425.

  3. Wang Jun, Yuan Bo, Han R P S*. Modulus of elasticity of randomly and aligned polymeric scaffolds with fiber size dependency[J]. Journal of the Mechanical Behavior of Biomedical Materials, 2018, 77(Supplement C): 314–320.

  4. Wang Lei, Song Congshen, Wang Jun*, Xiao Fei, Zhang Wenqi, Cao Liqiang. A wet etching approach for the via-reveal of a wafer with through silicon vias[J]. Microelectronic Engineering, 2017, 179(Supplement C): 31–36.

  5. Lin Lin, Wang Jun*,Wang Lei,Zhang Wenqi,The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process,Microelectronics Reliability,2016.10.01,65:198~204

  6. Wang Lei,Xu Chen,Lin Lin,Yang Chen,Wang Jun*,Xiao Fei,Zhang Wenqi,Thermal stress analysis of the low-k layer in a flip-chip package,Micro electronic Engineering,2016.9.1,163:78~82

  7. Yuan Bo, Wang Jun*,Han R.P.S.*,Capturing tensile size-dependency in polymer nanofiber elasticity,Journal of the Mechanical Behavior of Biomedical Materials,2015.2.1,42(2):26~31

  8. Pang Junwen, Wang Jun*,The Thermal Stress Analysis for IC Integrations with TSV Interposer by Complement Sector Models,Journal of Electronic Materials,2014.9.01,43(9):3423~3435

  9. Ma He,Yu Daquan, Wang Jun*,The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer,Microelect ronics Reliability,2014.2.01,54(2):425~434